Electronic device and method of manufacturing the same

ABSTRACT

An electronic device including a base structure, a first pattern having at least one projection disposed on the base structure, a first conductive layer including a first portion disposed on the base structure and a second portion disposed on the first pattern and connected to the first portion, an insulating layer disposed on the first conductive layer covering the first portion and exposing the second portion, and a second conductive layer provided on the insulating layer and overlapping the first conductive layer. The second conductive layer is spaced apart from the first portion and is in contact with the second portion. Methods of manufacturing an electronic device capable of reducing the number of process steps in the manufacturing process are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/356,156, filed on May 18, 2019, which is a continuation of U.S.patent application Ser. No. 15/623,949, filed Jun. 15, 2017, issued asU.S. Pat. No. 10,269,889, which claims priority from and the benefit ofKorean Patent Application No. 10-2016-0076720, filed on Jun. 20, 2016,which is hereby incorporated by reference for all purposes as if fullyset forth herein.

BACKGROUND Field

The invention relates generally to an electronic device and a method ofmanufacturing the same, and, more particularly, to a method ofmanufacturing an electronic display device more easily and theelectronic display device manufactured thereby.

Discussion of the Background

An electronic device is activated in response to an electrical signal.The electronic device may include a display device, which is configuredto display an image, or a touch screen, which is configured to sense atouch event from the outside.

The electronic device may also include various electrode patterns, whichare used to transmit an electrical signal for activating the electronicdevice. The electrode patterns may also be used to transmit electricsignals, which are used to display information or are produced by atouch event from the outside.

Manufacturing of electronic display devices, particularly those withtouch screens, is complex as multiple layers of electrode patterns arerequired to be made in a multiple semi-conductor processing steps. Themore layers the more complex processing steps are required and thedevice becomes thicker as more layers are added.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventiveconcepts, and, therefore, it may contain information that does not formthe prior art that is already known in this country to a person ofordinary skill in the art.

SUMMARY

Electronic devices constructed according to the principles of theinvention enable two conductive patterns at different levels to be moreeasily coupled to each other than in conventional devices.

Methods of manufacturing an electronic device according to theprinciples of the invention are capable of reducing the number ofprocess steps in the manufacturing process. For example, step patternsmay be provided to connect two conductive patterns disposed at differentlevels to each other without needing to etch or otherwise engage in aprocess step to form a contact hole.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to one aspect of the invention, an electronic device includesa base structure, a first pattern having at least one projection, afirst conductive layer, an insulating layer, and a second conductivelayer provided on the insulating layer and overlapping the firstconductive layer.

The at least one projection may be disposed on the base structure.

The first conductive layer may include a first portion disposed on thebase structure and a second portion, disposed on the first pattern andconnected to the first portion.

The insulating layer may be disposed on the first conductive layercovering the first portion and exposing the second portion.

The second conductive layer may be spaced apart from the first portionand may be in contact with the second portion.

The insulating layer may have a thickness that is substantially equal toa sum of thicknesses of the first pattern and the second portion.

A top surface of the second portion of the first conductive layer may beexposed through the insulating layer, and the top surface of the secondportion may be substantially coplanar with that of the insulating layer.

The first conductive layer may include a plurality of first sensorportions, a plurality of first connecting portions, each of which isprovided between the first sensor portions and connects adjacent ones ofthe first sensor portions, and a plurality of first dummy patterns,which are electrically disconnected from the first sensor portions andthe first connecting portions.

The second conductive layer may include a plurality of second sensorportions, a plurality of second connecting portions, each of which isprovided between adjacent ones of the second sensor portions andconnects the adjacent ones of the second sensor portions, and aplurality of second dummy patterns, which are electrically disconnectedfrom the second sensor portions and the second connecting portions.

The first pattern may be a plurality of step patterns, each of theplurality of step patterns overlaps a corresponding one of the firstsensor portions. The second portion of each of the plurality of firstsensor portions may be connected to the plurality of second dummypatterns.

The step pattern may include a plurality of step patterns, each of theplurality of step pattern overlaps a corresponding one of the pluralityof first sensor portions and a corresponding one of the plurality offirst dummy patterns. The second portion of each of the plurality offirst sensor portions may be connected to the plurality of second dummypatterns and the second portion of each of the plurality of first dummypatterns may be connected to the plurality of second sensor portions.

The second conductive layer may include a plurality of first sensorportions, a plurality of first connecting portions, each of which isprovided between adjacent ones of the first sensor portions and connectsthe adjacent ones of the first sensor portions, and a plurality ofsecond sensor portions, which are electrically disconnected from thefirst sensor portions and the plurality of first connecting portions.

The first conductive layer may include a plurality of second connectingportions, each intersecting a corresponding one of the plurality offirst connecting portions.

The first pattern may be a plurality of step patterns, each of theplurality of step patterns overlap a corresponding one of the pluralityof second connecting portions. The second portion may be defined in theplurality of second connecting portions to be connected to the pluralityof second sensor portions.

The first pattern may include an organic material.

The electronic device may further include a display layer provided onthe base structure to display an image and a thin-film encapsulationlayer provided on the display layer to cover the display layer. Thefirst conductive layer may be disposed on the thin-film encapsulationlayer.

The display layer may include a first electrode, a pixel defining layerwhich defines an opening exposing at least a portion of the firstelectrode, a light emitting layer provided in the opening, and a secondelectrode provided on the light emitting layer.

Each of the first and second conductive layers may overlap the pixeldefining layer and might not overlap the opening.

Each of the first and second conductive layers may include a pluralityof mesh lines.

The second portion may include at least one of the plurality of meshlines.

The electronic device may further include a black matrix overlapping thepixel defining layer.

A width of a portion of the black matrix may be substantially the sameas that of a portion of the pixel defining layer that overlaps theportion of the black matrix.

The first pattern may be black.

A width of a portion of the black matrix that overlaps the first patternmay be substantially the same as that of a portion of the plurality ofmesh lines that overlaps the portion of the black matrix, when measuredin a first direction.

According to another aspect of the invention, a method of manufacturingan electronic device may include providing a base structure, forming afirst pattern having at least one projection on the base structure,forming a first conductive layer including a first portion and a secondportion, the first portion being disposed on the base structure and thesecond portion being disposed on the first pattern, forming apreliminary insulating layer on the base structure covering the firstconductive layer and the first pattern, etching the preliminaryinsulating layer to form an insulating layer covering the first portionand exposing a top surface of the second portion, and forming a secondconductive layer on the insulating layer and the first conductive layer.

The etching of the preliminary insulating layer may be performed using adry etching process.

The step of forming the first pattern may include forming a steppattern. The step of forming the insulating layer may include formingthe insulating layer to have a thickness substantially equal to a sum ofthicknesses of the step pattern and a portion of the first conductivelayer positioned on the step pattern, and the top surface of the firstconductive layer positioned on the step pattern may be substantiallycoplanar with a top surface of the insulating layer.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1 is a perspective view of a first embodiment of an electronicdevice constructed according to the principles of the invention.

FIG. 2 is a plan view of the electronic device of FIG. 1 .

FIGS. 3A to 3D are plan views of various layers of the electronic deviceof FIG. 1 .

FIG. 4 is a fragmented cross-sectional view taken along lines I-I′ andII-II′ of FIGS. 3A to 3D.

FIG. 5 is a plan view of a second embodiment of an electronic deviceconstructed according to the principles of the invention.

FIG. 6 is a cross-sectional view taken along line III-III′ of FIG. 5 .

FIG. 7 is a cross-sectional view of a third embodiment of an electronicdevice constructed according to the principles of the invention.

FIG. 8 is a cross-sectional view of a portion of the electronic deviceof FIG. 7 .

FIG. 9 is a cross-sectional view of a portion of a fourth embodiment ofan electronic device constructed according to the principles of theinvention.

FIGS. 10A to 10F are cross-sectional views of the first embodiment of anelectronic device during various stages of a method of manufacturing theelectronic device according to the principles of the invention.

It should be noted that these figures are intended to illustrate thegeneral characteristics of methods, structure and/or materials utilizedin certain example embodiments and to supplement the written descriptionprovided below. These drawings are not, however, to scale and might notprecisely reflect the precise structural or performance characteristicsof any given embodiment, and should not be interpreted as defining orlimiting the range of values or properties encompassed by exampleembodiments. For example, the relative thicknesses and positioning ofmolecules, layers, regions and/or structural elements may be reduced orexaggerated for clarity. The use of similar or identical referencenumbers in the various drawings is intended to indicate the presence ofa similar or identical element or feature.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

As shown in FIG. 1 , an electronic device 1000 may be configured tosense an external touch event, e.g. touching the device with a finger orimplement from the outside. Elsewhere herein, a touch event may bereferred to as merely a “touch” for the sake of simplicity. Theelectronic device 1000 may be a touch screen or a touchable displaydevice.

The touch event from the outside may occur in various manners. FIG. 1illustrates an example in which a touch event is detected when a part ofthe human body such as a user's hand approaches or is in contact withthe electronic device 1000.

However, the electronic device 1000 may also detect a state, in which apart of an inanimate object such as a stylus pen approaches or is incontact with the electronic device 1000, as the touch event.Furthermore, the electronic device 1000 may detect an external touchevent using various sensing elements such as optical, contact-sensitive,heat-sensitive, and magnetic elements.

The electronic device 1000 may include an active area AA and aperipheral area NAA, when viewed in plan. The active area AA may beactivated to sense an external touch event, when an electrical signal isapplied thereto.

The active area AA may be defined in a center of the electronic device1000. However, depending on the intended use of the electronic device1000, the active area AA may be defined to be in another location, e.g.,offset toward an edge or a side of the electronic device 1000.

The peripheral area NAA may be defined to be adjacent to the active areaAA. The electronic device 1000 may be designed to not detect an externaltouch event applied to the peripheral area NAA.

FIG. 1 illustrates an example in which the peripheral area NAA isdefined in the form of a frame surrounding the active area AA. However,other configurations are possible, e.g., the peripheral area NAA mayhave various shapes. In certain embodiments, the electronic device 1000may have a top surface, which is defined by first and second (e.g., xand y) directions DR1 and DR2 that are not parallel to each other; and,the entirety of the top surface of the electronic device 1000 may bedefined as the active area AA, such that the peripheral area NAA may beomitted.

The electronic device 1000 may include a base structure 100 and a touchstructure 200. The base structure 100 may be used to dispose the touchstructure 200 thereon. That is, the base structure 100 may be used as asubstrate upon which the touch structure 200 is disposed.

For example, the base structure 100 may be an insulating substrate or aninsulating film that is formed of an insulating material (e.g., glass orpolymer resin). When the base structure 100 is an insulating substrate,the electronic device 1000 may have an increased hardness. When the basestructure 100 is an insulating film, the electronic device 1000 may haveincreased flexibility.

The base structure 100 may include be a multi-layered structure, inwhich a plurality of organic layers and/or a plurality of inorganiclayers are stacked. This may make it possible for the electronic device1000 to be thinner.

The structure of the base structure 100 may be changed from the examplesgiven above.

The touch structure 200 may be provided on one of surfaces of the basestructure 100. In FIG. 1 the touch structure 200 is provided on a topsurface of the base structure 100, but other orientations arepermissible. For example, the touch structure 200 may be provided on abottom surface of the base structure 100.

The touch structure 200 may be configured to detect a touch event fromthe outside. As shown in FIG. 2 , the touch structure 200 may include aplurality of first electrodes TE1, a plurality of second electrodes TE2,a plurality of first wiring patterns WP1, a plurality of second wiringpatterns WP2, a plurality of first pads PD1, and a plurality of secondpads PD2.

Although, in FIG. 2 , the first electrodes TE1, the second electrodesTE2, the first wiring patterns WP1, the second wiring patterns WP2, thefirst pads PD1, and the second pads PD2 are arranged on a single layer,other configurations are possible. For example, at least two or all ofthese components may be disposed on different layers.

The first electrodes TE1 and the second electrodes TE2 may be providedin the active area AA. The electronic device 1000 may further include aninsulating layer ILD which is used to electrically separate the firstand second electrodes TE1 and TE2 from each other.

As is known in the art, the first electrodes TE1 may be used to outputsensing signals, whereas the second electrodes TE2 may be used toreceive driving signals. In the electronic device 1000, the drivingsignals may be applied to the second electrodes TE2 and such drivingsignals may be used to scan the active area AA. Also, in the electronicdevice 1000, the sensing signals may be output from the first electrodesTE1 and may be used to sense a region where a touch occurs.

Alternatively, or additionally, the first electrodes TE1 may be used toreceive the driving signals, and the second electrodes TE2 may be usedto output the sensing signals. In addition, the first and secondelectrodes TE1 and TE2 may also be used to receive or output otherelectrical signals.

The first electrodes TE1 may extend in the first direction DR1 and maybe arranged in the second direction DR2.

Each of the first electrodes TE1 may include a plurality of first sensorportions SP1 and a plurality of first connecting portions CP1. The firstsensor portions SP1 may be arranged in the first direction DR1 and eachof the first connecting portions CP1 may be provided to connect thefirst sensor portions SP1 to each other.

The second electrodes TE2 may extend in the second direction DR2 and maybe arranged in the first direction DR1. Each of the second electrodesTE2 may include a plurality of second sensor portions SP2 and aplurality of second connecting portions CP2. The second sensor portionsSP2 may be arranged in the second direction DR2 and each of the secondconnecting portions CP2 may be provided to connect the second sensorportions SP2 to each other.

Each of the first and second sensor portions SP1 and SP2 may include aplurality of mesh lines MSL. Accordingly, the first electrodes TE1 andthe second electrodes TE2 may have an improved flexibility and thus theelectronic device 1000 may be easier to fold.

Alternatively, at least one of the first and second sensor portions SP1and SP2 may be provided in a bulk structure, not in the mesh structure.

The first wiring patterns WP1 and the second wiring patterns WP2 may beprovided in the peripheral area NAA. The first wiring patterns WP1 maybe respectively connected to the first electrodes TE1 and the secondwiring patterns WP2 may be respectively connected to the secondelectrodes TE2.

The first and second pads PD1 and PD2 may be provided in the peripheralarea NAA. The first and second pads PD1 and PD2 may be connected to thefirst and second wiring patterns WP1 and WP2, respectively.

The electronic device 1000 may receive a power voltage from an externalpower supply through the first and second pads PD1 and PD2 and/or outputa signal that corresponds to an external touch event sensed through theactive area AA, to the outside through the first and second pads PD1 andPD2.

The first and second pads PD1 and PD2 are shown sequentially arranged,but the first and second pads PD1 and PD2 may be arranged in analternating or partially-separated manner or in some other arrangement.

The touch structure 200 may be operated to detect an external touchevent through an electrostatic capacitance coupling between the firstelectrodes TE1 and the second electrodes TE2 or in an electrostaticcapacitance manner. However, the touch structure 200 may sense anexternal touch in various other manners, such as resistance layer,optical, ultrasonic wave, or coordinate recognition manners, and mayhave an electrode structure corresponding thereto.

FIGS. 3A and 3B illustrate elements provided on the base structure 100,FIG. 3C illustrates the insulating layer ILD, and FIG. 3D illustrateselements provided on the insulating layer ILD. In FIGS. 3A to 3D, toreduce complexity in the drawings, the base structure 100 is illustratedby a dotted line.

As shown in FIGS. 3A to 4 , the electronic device 1000 may include abase structure 100, a plurality of step patterns ST, such as ST-Adescribed below, a first conductive layer CL1, an insulating layer ILD,and a second conductive layer CL2. The first conductive layer CL1 may beprovided between the base structure 100 and the insulating layer ILD,and the second conductive layer CL2 may be provided on the insulatinglayer ILD.

The first conductive layer CL1, the insulating layer ILD, and the secondconductive layer CL2 may be sequentially stacked in an upward direction(hereinafter, a third direction DR3).

Referring to FIG. 3A, the step patterns ST may be provided on the basestructure 100. The step patterns ST may be provided in the active areaAA. The step patterns ST may be arranged to be spaced apart from eachother.

The step patterns ST may partially overlap the first conductive layerCL1. In addition, the step patterns ST may be provided at positionscorresponding to a plurality of opening areas OA, which will bedescribed below.

The step patterns ST may be formed of or include an organic material.The step patterns ST may be transparent. However, the step patterns ST,alternatively, may be black or some other color or opacity.

As shown in FIG. 3B, the first conductive layer CL1 may be provided onthe base structure 100. The first conductive layer CL1 may be disposedin the active area AA. FIG. 4 illustrates one of the step patterns ST(e.g., a step pattern ST-A).

Referring to FIGS. 3B and 4 , the first conductive layer CL1 may includea first portion P1, which does not overlap the step pattern ST-A, and asecond portion P2, which overlaps the step pattern ST-A. The first andsecond portions P1 and P2 may be connected to each other, therebyforming a single conductive pattern. The connection between the firstportion P1 and the second portion P2 is shown by, for example, the gridarray of continuous electrically conductive lines that pass throughsectional line I-I′ in FIG. 3B.

The second portion P2 may be disposed on top of the plurality of thestep patterns ST. In other words, the first portion P1 may be disposedat the same level as those of the step patterns ST, and the secondportion P2 may be disposed at a level higher than those of the steppatterns ST. The first and second portions P1 and P2 of the firstconductive layer CL1 may be classified as such based on their levelsrelative to the step patterns ST.

The first conductive layer CL1 may include a plurality of first sensorportions SP1, a plurality of first connecting portions CP1, and aplurality of first dummy patterns DP. The first sensor portions SP1 andthe first connecting portions CP1 may be connected to each other,thereby constituting a first electrode TE1.

The first dummy patterns DP1 may be separated from and electricallydisconnected from the first sensor portions SP1 and the first connectingportions CP1. The first dummy patterns DP1 and the first sensor portionsSP1 may be alternately arranged.

The first conductive layer CL1 may include a plurality of first meshlines MSL1. Each of the first sensor portions SP1, the first connectingportions CP1, and the first dummy patterns DP1 may consist of, orinclude, a plurality of the first mesh lines MSL1.

The second portion P2 may consist of or include at least one mesh line.When viewed in a plan view, an area of the second portion P2 may bechanged by the step pattern ST-A.

As shown in FIG. 3C, the insulating layer ILD may be disposed on thebase structure 100 covering the first sensor portions SP1, the firstconnecting portions CP1, and the first dummy patterns DP. The insulatinglayer ILD may include a transparent insulating material.

For example, the insulating layer ILD may include an organic material.The insulating layer ILD may have a flat top surface that is positionedover the first conductive layer CL1. The insulating layer ILD may be amulti-layered structure including an organic layer and an inorganiclayer; but, this multi-layered structure is not required.

The insulating layer ILD may be a single structure that overlaps both ofthe active area AA and the peripheral area NAA. A plurality of theopening areas OA may be defined in the insulating layer ILD. The openingareas OA may be defined within the active area AA.

In the illustrated embodiments, the opening areas OA may be arranged atpositions respectively corresponding to the first dummy patterns DP1 andthe first sensor portions SP1, but other configurations are possible.For example, a plurality of the opening areas OA may correspond to oneof the first dummy patterns DP1 or one of the first sensor portions SP1.

The insulating layer ILD may be formed to partially expose the firstconductive layer CL1 through the opening areas OA. As shown in FIG. 4 ,a top surface of the first portion P1 may be fully covered by theinsulating layer ILD.

By contrast, a top surface of the second portion P2 might not be fullycovered by the insulating layer ILD and may be exposed. The top surfacesof the second portion P2 and the insulating layer ILD may besubstantially coplanar with each other and may thus define substantiallythe same plane. A side surface of the second portion P2 may be fullycovered by the insulating layer ILD.

As shown in FIG. 3D, the second conductive layer CL2 may be provided onthe insulating layer ILD. The second conductive layer CL2 may bedisposed in the active area AA and the peripheral area NAA.

The second conductive layer CL2 may include a plurality of second sensorportions SP2, a plurality of second connecting portions CP2, and aplurality of second dummy patterns DP2, which are provided in the activearea AA. The second sensor portions SP2 and the second connectingportions CP2 may be connected to each other, thereby constituting asecond electrode TE2.

The second sensor portions SP2 may overlap the first dummy patterns DP1,when viewed in a plan view. The second dummy patterns DP2 may beseparated from and electrically disconnected from the second sensorportions SP2 and the second connecting portions CP2.

The second dummy patterns DP2 and the second sensor portions SP2 may bealternately arranged. The second dummy patterns DP2 may overlap thefirst sensor portions SP1, when viewed in a plan view.

The second conductive layer CL2 may include a plurality of second meshlines MSL2. Each of the second sensor portions SP2, the secondconnecting portions CP2, and the second dummy patterns DP2 may consistof the second mesh lines MSL2, but other arrangements are permissible.For example, each of the second sensor portions SP2, the secondconnecting portions CP2, and the second dummy patterns DP2 may have abulk structure, rather than the mesh structure shown.

The second conductive layer CL2 may further include first wiringpatterns WP1, second wiring patterns WP2, at least one first pad PD1,and at least one second pad PD2, which are provided in the peripheralarea NAA.

Referring to FIGS. 3D and 4 , the second dummy patterns DP2 may overlapthe opening areas OA. Here, the second dummy patterns DP2 may be incontact with the second portion P2 that is exposed by the opening areasOA. The second dummy patterns DP2 may be coupled to the second portionP2 and thereby may be connected to the first sensor portions SP1,respectively.

Similarly, the second sensor portions SP2 may overlap the opening areasOA. The second sensor portions SP2 may be in contact with the secondportion P2 exposed by the opening areas OA. The second sensor portionsSP2 may be coupled to the second portion P2 and thereby may be connectedto the first dummy patterns DP1, respectively.

The first wiring patterns WP1, the second wiring patterns WP2, the firstpads PD1, and the second pads PD2 may be provided on the insulatinglayer ILD. The first wiring patterns WP1 may be provided to connect thefirst pads PD1 to the second dummy patterns DP2, and the second wiringpatterns WP2 may be provided to connect the second pads PD2 to thesecond sensor portions SP2.

The first pads PD1 may be provided at a level different from that of thefirst mesh lines MSL1 constituting the first sensor portions SP1. Sincethe second dummy patterns DP2 are electrically connected to the firstsensor portions SP1, electrical signals provided to the first pads PD1may be transmitted to the first sensor portions SP1.

Accordingly, all of the first wiring patterns WP1, the second wiringpatterns WP2, the first pads PD1, and the second pads PD2 may beprovided at the same level.

However, the first wiring patterns WP1, the second wiring patterns WP2,the first pads PD1, and the second pads PD2 may be provided at differentlevels.

As shown in FIG. 4 , the first portion P1 may be spaced apart from thesecond mesh lines MSL2 with the insulating layer ILD interposedtherebetween. The second portion P2 may be in direct contact with acorresponding, i.e., overlapping, one of the second mesh lines MSL2. Thethickness of the insulating layer ILD may be substantially equal to asum of thicknesses of the step pattern ST-A and the second portion P2.

The insulating layer ILD may be formed to have the same thickness as thesum of thicknesses of the step pattern ST-A and the second portion P2,and thus, the second mesh lines MSL2 may be in direct contact with thesecond portion P2. Accordingly, it is possible to connect two conductivepatterns, which are disposed at different levels, to each other withoutneeding to etch or otherwise engage in a process step to form a contacthole.

Hereinafter, a second embodiment of an electronic device 1000-1 will bedescribed with reference to FIGS. 5 and 6 . For concise description,elements previously described with reference to FIGS. 1 to 4 may beidentified by a similar or identical reference number without repeatingredundant descriptions thereof.

Referring to FIGS. 5 and 6 , the step patterns ST may be provided on thebase structure 100. The first conductive layer CL1 may be provided onthe base structure 100 and the step patterns ST.

The first conductive layer CL1 may include a plurality of secondconnecting portions CP2-1, each of which consists of or includes thefirst mesh lines MSL1.

The first mesh lines MSL1 may include the first portion P1 disposed onthe base structure 100 and the second portion P2 disposed on the steppatterns ST. The insulating layer ILD may be disposed on the first meshlines MSL1 to cover the first portion P1 and to expose the secondportion P2.

The second conductive layer CL2 may be provided on the insulating layerILD. The second conductive layer CL2 may include a plurality of firstsensor portions SP1-1, a plurality of first connecting portions CP1-1,and a plurality of second sensor portions SP2-1. The second conductivelayer CL2 may consist of or include the second mesh lines MSL2.

The first portion P1 may be spaced apart from the second mesh lines MSL2with the insulating layer ILD interposed therebetween. The secondportion P2 may be in direct contact with a corresponding one of thesecond mesh lines MSL2. The thickness of the insulating layer ILD may besubstantially equal to the sum of thicknesses of the step pattern ST-Aand the second portion P2.

Regarding FIG. 7 and FIG. 8 , for concise description, elementspreviously described with reference to FIGS. 1 to 6 may be identified bya similar or identical reference number without repeating redundantdescriptions thereof.

Referring to FIG. 7 , an electronic device 1001 may be a touch screenpanel which is configured to display an image. The electronic device1001 may include a display layer DPL, which is configured to display animage in response to electric signals applied thereto and includes aplurality of pixels.

As shown in FIGS. 7 and 8 , the electronic device 1001 may include abase layer BSL, a thin-film encapsulation layer TFE, and a sensing layerTSL, in addition to the display layer DPL.

The base layer BSL may be formed of, or include, a flexible insulatingmaterial. The base layer BSL may correspond to the base structure 100 ofthe electronic device 1000 of FIG. 1 .

The base layer BSL may include a plurality of insulating layers and aplurality of conductive layers. The plurality of conductive layers andthe plurality of insulating layers may constitute a thin-film transistorand a capacitor which are connected to a display device DEM.

The display layer DPL may be provided between the base layer BSL and thesensing layer TSL. The display layer DPL may be operated in any one ormore of front-side, back-side, or both-sides light-emitting manners.

The display layer DPL may include the display device DEM and a pixeldefining layer PDL.

The display device DEM may be provided on the base layer BSL. Thedisplay device DEM may emit light corresponding to an electrical signal,which is transmitted through a thin-film transistor and a capacitor,thereby displaying an image.

The display device DEM may be realized in various manners. For example,the display device DEM may be an electrophoresis device, a liquidcrystal capacitor, an electrowetting device, or an organic lightemitting device. The description that follows will refer the displaydevice DEM that is an organic light emitting device as an example.

The pixel defining layer PDL may be provided on the base layer BSL.Openings OP may be defined in the pixel defining layer PDL.

Each of the openings OP may be provided to expose a portion of a firstelectrode EL1 and to define an empty space enclosed by the pixeldefining layer PDL. Each of the openings OP may define a region in whicheach display device DEM is provided.

The display device DEM may include the first electrode EL1, a lightemitting layer EML, and a second electrode EL2. Depending on a potentialdifference between the first electrode EL1 and the second electrode EL2,the light emitting layer EML of the display device DEM may be activatedto generate light.

The thin-film encapsulation layer TFE may be provided between thedisplay layer DPL and the sensing layer TSL. The thin-film encapsulationlayer TFE may have a multi-layered structure, in which organic and/orinorganic layers are stacked. The thin-film encapsulation layer TFE maybe provided to seal the display layer DPL and thereby to prevent outsidemoisture from flowing into the display layer DPL.

The sensing layer TSL may be directly disposed on the thin-filmencapsulation layer TFE. This may make it possible for the electronicdevice 1001 to be thinner and thereby be more portable and morefoldable.

The sensing layer TSL may be configured to sense a touch event to beapplied from the outside. The sensing layer TSL may correspond to thetouch structure 200 of the electronic device 1000 of FIG. 1 .

The first mesh lines MSL1 and the step pattern ST-A may be provided onthe thin-film encapsulation layer TFE. The step pattern ST-A may includea transparent organic material. The step pattern ST-A may overlap thepixel defining layer PDL. The step pattern ST-A may have a width S-Wless than that of the pixel defining layer PDL, when measured in adirection intersecting the first direction DR1 and/or the seconddirection DR2.

The electronic device 1001 may further include a thin-film encapsulationlayer and a color filter layer interposed between the first mesh linesMSL1.

The first and second mesh lines MSL1 and MSL2 may overlap the pixeldefining layer PDL but might not overlap the light emitting layer EML.Accordingly, it is possible to reduce the effect of the first and secondmesh lines MSL1 and MSL2 on a display property of the electronic device1001. The first and second mesh lines MSL1 and MSL2 may be formed of, orinclude, an opaque material. This may make it possible to use a widervariety of materials for the first and second mesh lines MSL1 and MSL2.

The electronic device 1001 may further include a passivation layer PVLwhich is provided to cover the second mesh lines MSL2. The passivationlayer PVL may protect the second mesh lines MSL2.

A black matrix BM may be provided on the passivation layer PVL. Theblack matrix BM may overlap the pixel defining layer PDL. The blackmatrix BM may entirely overlap the pixel defining layer PDL. In otherwords, when measured in a direction intersecting the first direction DR1and/or the second direction DR2, the width B-W of the black matrix BMmay be substantially equal to that of the pixel defining layer PDL.

Referring now to the fourth embodiment of FIG. 9 , except for the steppattern ST-A and the black matrix BM, the electronic device 1001-1 shownin FIG. 9 may have substantially the same features as those of theelectronic device 1001 of FIG. 8 . For concise description, elementspreviously described with reference to FIG. 8 may be identified by asimilar or identical reference number without repeating redundantdescriptions thereof.

As shown in FIG. 9 , step pattern ST-A1 may be black. The step patternST-A1 may entirely overlap the pixel defining layer PDL. The steppattern ST-A1 may have a width S-W that is substantially equal to thatof the pixel defining layer PDL, when measured in a directionintersecting the first direction DR1 and/or the second direction DR2.Accordingly, the step pattern ST-A1 may prevent the pixel defining layerPDL, which is positioned below the step pattern ST-A1, from being seenby a user. When light generated in the display device DEM is not emittedthrough the openings OP and propagates toward a region adjacent to theopenings OP, the step pattern ST-A1 may prevent such light from beingleaked to the outside.

A black matrix BM-1 may overlap the pixel defining layer PDL. The blackmatrix BM-1 may include a first black matrix BM-11, which overlaps thestep pattern ST-A1, and a second black matrix BM-12, which does notoverlap the step pattern ST-A1.

The first black matrix BM-11 may entirely overlap a second mesh lineMSL2 disposed on the step pattern ST-A1 among the plurality of thesecond mesh lines MSL2. Accordingly, the first black matrix BM-11 mayprevent the second mesh line MSL2, which is disposed on the step patternST-A1, from being seen by a user. A width B1-W of the first black matrixBM-11 may be substantially equal to a width M-W of the second mesh lineMSL2, which is disposed on the step pattern ST-A1.

The second black matrix BM-12 may entirely overlap the pixel defininglayer PDL disposed below the second black matrix BM-12.

Hereinafter, a method of manufacturing the electronic device 1000 willbe described with reference to FIGS. 10A to 10F For concise description,previously-described elements may be identified by a similar oridentical reference number without repeating redundant descriptionsthereof.

As shown in FIG. 10A, the step pattern ST-A may be formed on the basestructure 100. The step pattern ST-A may be formed by patterning anorganic layer.

Thereafter, as shown in FIG. 10B, the first conductive layer CL1,including the plurality of the first mesh lines MSL1, may be formed onthe base structure 100 and the step pattern ST-A. The first mesh linesMSL1 may be formed by patterning a conductive layer. The first portionP1 and the second portion P2 may be formed during the step of formingthe first mesh lines MSL1.

The step pattern ST-A may be formed to have a thickness in the directionDR3 (e.g., z-axis) greater than that of the first portion P1. The areaof the step pattern ST-A may be greater than that of the second portionP2.

Next, as shown in FIG. 10C, a preliminary insulating layer P-ILD may beformed on the base structure 100 to cover the first mesh lines MSL1 andthe step pattern ST-A. The preliminary insulating layer P-ILD may beformed to cover the first and second portions P1 and P2.

The preliminary insulating layer P-ILD may be formed to have a thicknessgreater than the sum of a thickness of one of the first mesh lines MSL1and the thickness of the step pattern ST-A.

Thereafter, as shown in FIGS. 10D and 10E, the preliminary insulatinglayer P-ILD may be etched to form an insulating layer ILD. Theinsulating layer ILD may be formed by a dry etching process. Forexample, the dry etching process may be performed using a gaseousetching material.

The etching of the preliminary insulating layer P-ILD may be performedto expose at least a portion of a top surface P2-U of the second portionP2 of the first mesh lines MSL1.

The insulating layer ILD may be formed in such a way that its thicknessis within a range capable of covering at least the first portion P1 andexposing the second portion P2. For example, the insulating layer ILDmay be thicker than the step pattern ST-A and may be thinner than a sumof thicknesses of the step pattern ST-A and the second portion P2.

The insulating layer ILD is depicted in this example as havingsubstantially the same thickness as the sum of thicknesses of the steppattern ST-A and the second portion P2. Accordingly, the top surfaceP2-U of the second portion P2 may be substantially coplanar with a topsurface ILD-U of the insulating layer ILD.

Thereafter, as shown in FIG. 10F, the second conductive layer CL2including a plurality of the second mesh lines MSL2 may be formed on theinsulating layer ILD and the first mesh lines MSL1. On the first portionP1, the second mesh lines MSL2 may be formed to be in contact with thetop surface ILD-U of the insulating layer ILD. On the second portion P2,the second mesh lines MSL2 may be formed to be in contact with the topsurface P2-U of the second portion P2.

The first pad PD1 may be formed on the top surface ILD-U of theinsulating layer ILD. The first pad PD1 may be formed at the same timeas the second mesh lines MSL2.

According to the principles of the invention described herein, even if acontact hole is not formed in the insulating layer ILD, the firstconductive layer CL1 readily can be coupled to the second conductivelayer CL2. Accordingly, even when an additional photolithography orother process step for forming a contact hole is omitted, the first andsecond conductive layers CL1 and CL2 can be coupled to each other byonly an etching process.

In the electronic device 1000, the second portion P2 exposed by theetching process may be in contact with a corresponding one of the secondmesh lines MSL2. Accordingly, it is possible to reduce both the processtime and the cost of manufacturing the display device.

According to the principles of the invention described herein, it ispossible to readily couple two conductive patterns located at differentlevels to each other.

And, thus, according to the principles of the invention describedherein, it is possible to simplify the process of manufacturing anelectronic device by eliminating an additional step in the manufacturingprocess.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. An electronic device, comprising: a displaylayer; a sensing layer disposed on the display layer and defining anactive area and a peripheral area adjacent to the active area; and ablack matrix disposed on the sensing layer, wherein: the sensing layercomprises: a first conductive layer disposed on the display layer; aninsulating layer disposed on the first conductive layer; a secondconductive layer disposed on the insulating layer; and a passivationlayer disposed on the second conductive layer; the passivation layeroverlaps entire surface of the active area; the black matrix is disposedon the passivation layer; the first conductive layer comprises aplurality of connecting portions; the second conductive layer comprisesa plurality of first portions, a plurality of second portions, and aplurality of sensor portions disposed on a same layer; the plurality ofconnecting portions and the plurality of sensor portions areelectrically connected; the plurality of first portions and theplurality of second portions are electrically connected; and theplurality of first portions and the plurality of second portions areinsulated from the plurality of connecting portions.
 2. The electronicdevice of claim 1, further comprising a thin-film encapsulation layerdisposed on the display layer, wherein the sensing layer is directlydisposed on the thin-film encapsulation layer.
 3. The electronic deviceof claim 2, wherein the thin-film encapsulation layer comprises aplurality of organic layers and an inorganic layer.
 4. The electronicdevice of claim 1, wherein the display layer comprises a pixel defininglayer having an opening defined therein and a light emitting layerdisposed in the opening.
 5. The electronic device of claim 4, whereinthe black matrix is non-overlapping with the opening.
 6. The electronicdevice of claim 4, wherein, when viewed in a plan view, the black matrixoverlaps the pixel defining layer, the first conductive layer, and thesecond conductive layer.
 7. The electronic device of claim 1, whereinthe black matrix is disposed directly on the passivation layer.
 8. Theelectronic device of claim 1, wherein the plurality of first portions,the plurality of second portions, and the plurality of sensor portionshave mesh structure.
 9. The electronic device of claim 1, wherein awidth of the black matrix is greater than a width of each of theplurality of connecting portions, the plurality of first portions, theplurality of second portions, and the plurality of sensor portions. 10.The electronic device of claim 1, wherein the black matrix comprises afirst black matrix and a second black matrix, and wherein a width of thefirst black matrix is the same as a width of each of the plurality ofconnecting portions, the plurality of first portions, the plurality ofsecond portions, and the plurality of sensor portions.
 11. Theelectronic device of claim 1, wherein, when viewed in a plan view, theblack matrix covers the first conductive layer and the second conductivelayer.